| measures for quality assurance |
| sample optically by means of microscope, normal-sighted eye or magnifying glass after each handling step |
| release after wire-bonding and forming |
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frequent samples of firmness of chip-connection with Diesheartest |
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frequent samples of firmness of wire-connection with Pull- and Ballsheartest |
| quality control by means of SPC |
| quality management system according to DIN ISO 9001:2008 certified |
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